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What’s after NAND?

Report No. FI-NFL-3DM-0111, January 2011


In the near future, floating gate NAND flash will encounter fundamental scaling limitations. A variety of technologies including Toshiba’s BiCs, Samsung’s VG-NAND, Macronix’s BE-SONOS, Hynix's Vertical Cylindrical FG, SanDisk’s 3D Memory and Intel/Micron’s PCMs (stackable PCM) offer the promise of continued increases in storage capacities and lower cost per bit necessary to enable new and emerging data storage applications.

What’s after NAND? provides an in-depth analysis of the post-planar floating gate NAND flash options and an independent assessment of the viability of these technologies going forward...

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